Thermal-Wet Scrubber for Semiconductor Market Size, Share, Growth, and Industry Analysis, By Types (?300 SLM, 300-500 SLM, ?500 SLM), By Applications Covered (CVD, Diffusion, Others), Regional Insights and Forecast to 2033

Thermal-Wet Scrubber for Semiconductor Market Size

The Thermal-Wet Scrubber for Semiconductor Market size was valued at USD 0.715 Billion in 2024 and is projected to reach USD 0.836 Billion in 2025, further growing to USD 2.914 Billion by 2033, exhibiting a compound annual growth rate (CAGR) of 16.9% during the forecast period from 2025 to 2033. This growth is driven by the increasing demand for effective air pollution control systems in semiconductor manufacturing, advancements in scrubber technology, and the growing need for environmental compliance in the semiconductor industry.

The US Thermal-Wet Scrubber for Semiconductor Market is experiencing strong growth, driven by the increasing need for effective air pollution control systems in semiconductor manufacturing. The market benefits from advancements in scrubber technology that improve efficiency and meet the growing environmental compliance requirements in the industry. Additionally, the rising focus on sustainability and the need to manage emissions from semiconductor production processes are contributing to the expansion of thermal-wet scrubbers in the United States.

Key Findings

• Market Size: Valued at 0.836B in 2025, expected to reach 2.914B by 2033, driven by expansion in semiconductor manufacturing and emissions control.
• Growth Drivers: Fab installations using hybrid scrubbers increased by 54%, audit-driven upgrades rose 39%, node advancements below 7nm boosted demand by 43%.
• Trends: IoT-enabled scrubber adoption rose 34%, modular system demand grew 29%, wet-plasma hybrid systems saw 38% uptake, and dual-stage units increased by 33%.
• Key Players: Unisem, Triple Cores Technology, Ebara Precision Machinery, Global Standard Technology, Busch Vacuum
• Regional Insights: Asia-Pacific leads with 42%, North America follows at 26%, Europe holds 22%, Middle East & Africa demand increased by 19%.
• Challenges: Retrofitting difficulties affected 28%, spatial constraints hit 34% of fabs, chemical waste management issues impacted 32%, energy consumption concerns rose by 27%.
• Industry Impact: Hazardous gas neutralization improved 96%, emissions compliance adoption up 41%, smart diagnostics usage increased 34%, fab process stability boosted by 31%.
• Recent Developments: Energy efficiency enhanced 33%, fluoride capture rose 39%, scrubber output capacity expanded 41%, compact model demand up by 31%, residue reduction by 42%.

The thermal-wet scrubber for semiconductor market is witnessing strong demand growth, primarily driven by increasing regulations around industrial gas emissions and the expanding scale of semiconductor fabrication plants globally. These scrubbers play a crucial role in abating hazardous by-products, acids, and volatile organic compounds generated during wafer fabrication, etching, and deposition processes. More than 63% of advanced semiconductor manufacturing facilities now deploy thermal-wet scrubbers as a part of their emission control systems. Integration of scrubbers with high-temperature thermal oxidation and liquid neutralization stages is becoming standard practice in fabs, especially in Asia-Pacific and North America.

Thermal-Wet Scrubber for Semiconductor Market Trends

The thermal-wet scrubber for semiconductor market is being shaped by the rapid scaling of wafer fabs and the tightening of environmental regulations related to toxic gas emissions. More than 58% of semiconductor manufacturers report increased investment in abatement systems, with thermal-wet scrubbers becoming the preferred choice due to their efficiency in managing multiple pollutants. Demand for scrubbers designed for fluorinated compound removal has risen by 42%, especially in facilities engaged in advanced lithography processes. Integration of AI-based system monitoring in emission control has increased by 36%, optimizing scrubber performance and maintenance cycles. In Asia-Pacific, particularly Taiwan and South Korea, over 61% of new fab constructions include advanced thermal-wet scrubber units, driven by both local air quality laws and international export compliance. Additionally, compact scrubber systems are trending, with 29% of fab operators seeking space-efficient models for modular cleanroom layouts. Manufacturers report a 33% increase in orders for integrated thermal and wet neutralization configurations, particularly for fabs producing chips below 7nm. These systems can neutralize over 96% of hazardous exhausts, reducing environmental compliance risk. The semiconductor sector’s transition to greener operations and cleanroom upgrades is propelling demand for thermal-wet scrubbers across global manufacturing hubs.

Thermal-Wet Scrubber for Semiconductor Market Dynamics

The thermal-wet scrubber for semiconductor market is influenced by the convergence of regulatory pressure, increasing semiconductor complexity, and the need for sustainable and efficient exhaust treatment systems. Semiconductor processes emit a wide range of toxic gases, including silane, ammonia, and fluorinated compounds. The use of thermal-wet scrubbers is growing as fabs scale up and move toward advanced nodes requiring tighter environmental controls. Demand is further strengthened by ESG initiatives and global climate standards that require fabs to limit emissions using efficient gas abatement systems.

OPPORTUNITY

Increased semiconductor demand across automotive, AI, and consumer electronics

As semiconductor production ramps up to meet global chip demand, the need for advanced emission abatement is growing. Over 49% of new investments in chip fabs now allocate budgets for dedicated gas treatment infrastructure, with thermal-wet scrubbers representing a preferred choice for multi-stage pollutant removal. Growth in 3D NAND and advanced logic chips has led to a 41% increase in hazardous process exhausts, which thermal-wet systems can effectively neutralize. The expanding use of highly reactive chemistries in EUV and FinFET processes also presents a 37% opportunity surge for specialized scrubber installations.

DRIVERS

Rising adoption of environmental safety systems in semiconductor fabs

Approximately 67% of new semiconductor facilities globally are installing thermal-wet scrubbers as standard abatement systems to meet emission standards. Over 54% of fabs in East Asia have transitioned to using hybrid scrubbers due to high output of corrosive gases from plasma etching and deposition tools. Adoption is also supported by a 39% rise in environmental audits conducted by industry regulators and chip buyers, pushing fabs to improve gas handling safety and emission compliance.

Restraints

"High initial installation cost and space limitations in existing cleanrooms"

Thermal-wet scrubber systems are capital-intensive, and 43% of fabs report cost as a limiting factor for full-facility implementation. Existing cleanrooms in legacy fabs face integration challenges due to a 34% space constraint rate when upgrading abatement systems. Additionally, 28% of fab managers cite difficulty in maintaining temperature uniformity and chemical compatibility when retrofitting thermal-wet systems into older exhaust architectures, slowing widespread deployment.

Challenge

"Complexity in managing diverse gas streams and chemical waste"

The challenge of handling diverse gaseous outputs in semiconductor fabs has increased by 46% as chipmaking processes become more intricate. Over 39% of scrubber installations require customization to address specific tool exhausts containing siloxanes, ammonia, and perfluorinated compounds. Chemical waste treatment compatibility is another hurdle, with 32% of facilities facing disposal issues due to reaction by-products formed in wet neutralization stages. This complexity in exhaust stream characterization and treatment limits standardized scrubber deployment and increases system downtime risks.

Segmentation Analysis

The thermal-wet scrubber for semiconductor market is segmented by type and application, reflecting the specific abatement needs of various fab operations. By type, scrubber systems are classified based on flow capacity—typically measured in Standard Liters per Minute (SLM)—to accommodate different volumes of hazardous gas emissions generated during manufacturing. Smaller systems (?300 SLM) are ideal for targeted abatement, while larger systems (>500 SLM) are essential for high-output facilities. In terms of application, scrubbers are used extensively in critical processes such as Chemical Vapor Deposition (CVD), diffusion furnaces, and others like ashing and etching. Each process emits different chemical compositions, which influence the scrubber design and treatment strategy. Over 47% of scrubbers used in CVD processes require multi-stage configurations, while 38% of those in diffusion environments emphasize high-temperature stability. This segmentation highlights the tailored approach required in semiconductor exhaust treatment and the increasing need for scrubber customization as wafer sizes and process complexities grow.

By Type

• ≤300 SLM: These scrubbers are compact and commonly used in low-volume or pilot semiconductor lines. They account for nearly 28% of the market due to ease of integration in space-limited environments. Adoption increased by 22% in R&D fabs and small-scale chip packaging plants. These units are ideal for operations involving intermittent emissions or single-tool applications.
• 300–500 SLM: Mid-range flow capacity scrubbers represent approximately 41% of installations, primarily in medium-output fabs with multiple deposition and etching tools. Demand for this category grew by 34%, especially in fabs transitioning from legacy nodes to 14nm and below. These systems offer a balance between thermal efficiency and chemical neutralization, making them suitable for multi-tool exhaust handling.
• ≥500 SLM: High-capacity scrubbers are deployed in large-scale semiconductor fabs with high-volume manufacturing. They hold about 31% of the market, with usage increasing by 39% in mega fabs producing advanced logic and memory chips. These systems support continuous abatement of fluorinated gases, ammonia, and corrosive chemicals at scale, making them vital for high-throughput operations.

By Application

• CVD: Thermal-wet scrubbers used in Chemical Vapor Deposition processes account for 46% of the total market. These processes emit silane, TEOS, and other volatile gases, requiring dual-stage thermal and wet abatement. Adoption increased by 37% with the growing production of 3D NAND and FinFET chips, which involve high-frequency CVD steps in fabrication.
• Diffusion: Scrubbers used in diffusion furnaces contribute around 34% of total installations. These processes emit large volumes of reactive gases like phosphine and boron trifluoride. Adoption in this category rose by 29%, particularly in memory fabs where uniform doping is critical. High-temperature abatement and chemical compatibility are key requirements in this segment.
• Others: This category includes scrubbers for etching, ashing, and cleaning applications. These units hold 20% of the market and are widely used across various fab nodes. The segment grew by 25%, with increased demand from foundries producing RF and analog chips. Flexibility and modular design are critical features in this group to accommodate mixed gas flows.

Regional Outlook

The thermal-wet scrubber for semiconductor market shows distinct regional trends shaped by fab expansions, emission regulations, and investments in cleanroom technologies. Asia-Pacific dominates the market due to its dense concentration of semiconductor foundries and integrated device manufacturers, accounting for more than 42% of global installations. South Korea, Taiwan, and China lead in deployment, especially in high-capacity fabs producing advanced nodes below 10nm. North America is rapidly scaling with the construction of new fabrication facilities under national semiconductor incentive programs. Europe is advancing in abatement adoption, particularly in Germany, Ireland, and France, driven by strict industrial emissions standards. The Middle East & Africa market is still emerging but showing signs of investment in greenfield chip plants and research hubs. Over 61% of global scrubber manufacturers are now localizing production to meet regional customization demands, and 48% of new fab builds include thermal-wet systems in their initial equipment planning. This region-wise momentum reflects the growing focus on sustainable semiconductor manufacturing.

North America

North America holds approximately 26% of the global thermal-wet scrubber market, with strong activity in the U.S. and Canada. Fab expansions in Arizona, Texas, and New York have driven a 33% increase in scrubber installations since 2022. Government subsidies for chip manufacturing have further spurred a 28% rise in investment for environmental control systems. Thermal-wet scrubbers are used in more than 61% of new fabs under development in North America. High emphasis on compliance with EPA and OSHA standards has led to widespread adoption of dual-stage abatement units with automated diagnostics.

Europe

Europe contributes around 22% to the global market, driven by strong environmental regulation and the rise of advanced packaging and automotive chip fabs. Germany and France lead in deployment, accounting for 57% of all thermal-wet scrubbers in the region. Fab expansions supported by national clean tech incentives resulted in a 31% growth in scrubber orders in 2024 alone. Emission standards under REACH regulations have triggered a 29% shift toward integrated high-efficiency abatement systems. Demand is also rising in smaller EU nations investing in silicon photonics and MEMS manufacturing.

Asia-Pacific

Asia-Pacific leads the global market with a 42% share, driven by major chip production in Taiwan, China, South Korea, and Japan. Over 68% of high-capacity fabs in this region utilize thermal-wet scrubbers to handle complex gas outputs. China saw a 37% rise in installations due to its aggressive semiconductor independence strategy. In South Korea, fabs producing memory and logic chips below 5nm reported a 43% spike in demand for high-flow abatement systems. Local environmental mandates have led to a 41% transition from dry-only systems to hybrid thermal-wet solutions.

Middle East & Africa

The Middle East & Africa region accounts for a modest but growing 10% of the market. The UAE and Israel are leading in semiconductor innovation hubs and cleanroom R&D labs. Scrubber installations in this region grew by 19% in 2025, primarily driven by tech zone developments and international collaborations. Saudi Arabia’s industrial diversification strategy includes chip packaging and sensor fabs, which contributed to a 23% rise in demand for compact, energy-efficient scrubbers. With increasing participation in high-tech exports, local fabs are aligning with international emission compliance standards.

LIST OF KEY Thermal-Wet Scrubber for Semiconductor Market COMPANIES PROFILED

Investment Analysis and Opportunities

The thermal-wet scrubber for semiconductor market is gaining strong investment traction due to increased semiconductor manufacturing capacity and environmental compliance mandates. In 2025, more than 47% of new fab construction projects allocated dedicated budgets for advanced gas abatement systems, with thermal-wet scrubbers being the preferred solution. Government subsidies in Asia-Pacific and North America have contributed to a 39% increase in capex spending for emission control infrastructure. Private equity and semiconductor equipment funds have increased their stake in abatement technology firms by 33%, targeting scrubber developers with proprietary wet chemical treatment innovations. Over 41% of fabs are integrating dual-stage thermal-wet units into cleanroom blueprints, reflecting their rising importance in full-node process readiness. The growth in hazardous by-products from FinFET, EUV, and 3D NAND production lines is creating a 37% opportunity increase for suppliers of high-capacity scrubbers. Furthermore, partnerships between fab builders and scrubber OEMs have risen by 28% to support co-developed, fab-specific solutions. As environmental regulations become more stringent, especially in China, South Korea, and the U.S., investments are flowing into next-gen modular, low-footprint scrubbers capable of >96% pollutant neutralization. These factors collectively point toward a sustained demand outlook and expanding business opportunities for scrubber manufacturers.

NEW PRODUCTS Development

New product development in the thermal-wet scrubber market is accelerating, with innovations centered on energy efficiency, modular design, and smart diagnostics. In 2025, over 34% of new systems released were equipped with IoT-enabled monitoring to provide real-time exhaust flow analysis and predictive maintenance. Compact designs optimized for sub-300 SLM operations saw a 27% rise in launch volume, targeting smaller fabs and R&D labs with space constraints. Companies like SemiAn Technology and Youngjin IND introduced integrated heat exchange units that reduced water consumption by 31% while maintaining abatement performance above 95%. High-temperature plasma-assisted oxidation was also introduced in select new models, boosting toxic gas breakdown efficiency by 38%. Across Japan and South Korea, vendors reported a 42% increase in demand for silicon-compatible scrubbers featuring low-residue internal coatings to minimize process contamination. Additionally, multi-gas handling units capable of treating silane, perfluorinated compounds, and acid vapors in a single chamber grew by 36% in deployment rate. Ebara Precision Machinery launched a scalable module that enables capacity expansion from 300 to 500 SLM without retrofitting, with initial adoption showing 29% cost savings per fab. These product enhancements support the shift toward smart, adaptable exhaust control systems aligned with evolving semiconductor production demands.

Recent Developments

• Ebara Precision Machinery: In March 2025, Ebara Precision Machinery unveiled a new high-flow modular thermal-wet scrubber capable of 500+ SLM with a 33% reduction in energy consumption. This system was adopted by two major South Korean fabs to address high-volume EUV lithography exhausts.
• Global Standard Technology: In January 2025, Global Standard Technology began pilot installations of a next-gen wet scrubbing system featuring triple-stage chemical neutralization. Early results showed a 39% boost in fluoride capture efficiency across plasma etching processes.
• Busch Vacuum: In February 2025, Busch Vacuum partnered with chip tool OEMs to integrate their vacuum-pump-compatible scrubbers. These systems recorded a 28% reduction in pump degradation due to enhanced corrosive gas filtration.
• KC Innovation: In April 2025, KC Innovation announced the development of a compact wet scrubber specifically for 200mm legacy fabs. Its small footprint design led to a 31% adoption increase among mid-size packaging and analog foundries.
• QES Group Berhad: In May 2025, QES Group Berhad expanded its Malaysia-based manufacturing plant to increase scrubber output by 41%. This expansion is aimed at fulfilling rising demand from Southeast Asian chip assembly and testing facilities.

REPORT COVERAGE

The thermal-wet scrubber for semiconductor market report provides comprehensive insights into the industry’s segmentation, trends, dynamics, key players, product development, and regional performance. The market is segmented by flow capacity into ≤300 SLM, 300–500 SLM, and ≥500 SLM, with mid-range units making up 41% of demand. Applications include CVD (46% share), diffusion (34%), and others such as etching and cleaning (20%). Asia-Pacific dominates with 42% market share, followed by North America (26%) and Europe (22%). Middle East & Africa is gaining traction with emerging fabs and research labs. The report profiles twelve leading players, with Global Standard Technology and Ebara Precision Machinery collectively holding 35% of the market. It includes investment insights highlighting a 47% budget allocation toward scrubbers in new fabs and a 33% increase in private equity activity. Product innovation trends reflect a 34% increase in IoT-enabled models and a 38% boost in plasma-assisted oxidation systems. Five recent developments from 2025 spotlight efficiency improvements, modularity, and new regional manufacturing initiatives. This report offers stakeholders strategic guidance for navigating emission compliance, equipment integration, and supplier partnerships in the evolving semiconductor landscape.