SiC Wafer Thinning Equipment Market Size, Share, Growth and Industry Analysis, By Types (Full-Automatic, Semi-Automatic), By Applications (Less than 6 Inch, 6 Inch and Above), Regional Insights and Forecast to 2035

SiC Wafer Thinning Equipment Market Size

The Global SiC Wafer Thinning Equipment Market reached USD 8.5 Million in 2025 and is projected to grow to USD 9.07 Million in 2026, further increasing to USD 9.68 Million by 2027. Long-term forecasts indicate the market will expand to USD 16.26 Million by 2035, supported by a solid CAGR of 6.7% from 2026 to 2035. Market growth is driven by rising adoption of full-automatic wafer thinning systems and strong demand from electric vehicle and power semiconductor manufacturing sectors. Technological advancements continue to accelerate industry expansion, including a 58% increase in AI-driven automated wafer handling and a 35% rise in CMP-enabled, eco-friendly machinery installations.

The US SiC Wafer Thinning Equipment Market is witnessing consistent expansion, primarily due to the robust electric vehicle ecosystem and rising investments in domestic semiconductor infrastructure. Around 54% of new fabs in the country now include SiC processing lines. Adoption of full-automatic equipment reached 61% in the latest production cycle, while AI-enabled control modules are embedded in 47% of new tool installations. The market also recorded a 31% rise in R&D funding for thinning technologies, along with a 42% increase in demand from power grid modernization and defense electronics sectors.

Key Findings

• Market Size: Valued at $8.5M in 2025, projected to touch $9.07M in 2026 to $16.26M by 2035 at a CAGR of 6.7%.
• Growth Drivers: Equipment demand rose by 45%, with AI-integrated tools adoption up 58% and full automation favored in 62% of fabs.
• Trends: Over 66% of installations shifted to 6-inch+ wafers, CMP usage up 35%, and eco-friendly tools adoption increased by 28%.
• Key Players: Disco, TOKYO SEIMITSU, Okamoto Semiconductor Equipment Division, CETC, Revasum & more.
• Regional Insights: Asia-Pacific holds 45% driven by EV and telecom demand, North America follows with 30%, Europe accounts for 20%, while Middle East & Africa contributes 5% through emerging pilot fabs and renewable energy projects.
• Challenges: 40% of fabs report integration issues, and 18% yield loss occurs due to wafer breakage during ultra-thin processes.
• Industry Impact: 52% of manufacturers upgraded systems, 31% increased production lines, and 44% restructured supply chains.
• Recent Developments: 57% of companies launched new tools, 34% improved AI functions, and 41% reduced environmental impact.

The SiC Wafer Thinning Equipment Market is evolving as a critical pillar in advanced semiconductor manufacturing, supporting electric vehicles, renewable energy, telecom, and aerospace industries. Over 62% of manufacturers now prioritize ultra-flat SiC wafers, while 73% of fabs demand integrated automation. Full-automatic tools dominate over 65% of installations, and AI-enabled control accounts for 58%. Equipment makers are racing to develop machines compatible with 8-inch wafers, with over 33% already investing in such platforms. Technological innovation, sustainability, and production efficiency are driving a new era of wafer thinning competitiveness worldwide.

SiC Wafer Thinning Equipment Market Trends

The SiC wafer thinning equipment segment is experiencing a sharp upswing in demand, driven by rapid adoption of Silicon Carbide in power and high-frequency applications. Global SiC wafer production surged by 31% year-over-year, reaching 1.52 million units, with 6-inch wafers alone accounting for over 48% of total output. In terms of equipment share, grinding systems lead with around 40%, followed closely by polishing machinery at 35%, while lapping comprises the remaining 25%. Regionally, Asia-Pacific continues to dominate, contributing roughly 45% of global equipment shipments, with North America and Europe at 30% and 20%, respectively. Automated systems are gaining traction: over 55% of new installations now include AI-based control modules, enabling ultra-thin wafers with less than 5µm variation across the surface. Meanwhile, equipment with eco-friendly chemical-mechanical planarization (CMP) technologies now make up around 60% of new machine orders, reflecting an industry shift toward sustainability. These robust trends underscore a market pivot toward high-precision, scalable, and greener thinning solutions—vital for meeting the burgeoning demand from EV, 5G, and renewable energy sectors.

SiC Wafer Thinning Equipment Market Dynamics

DRIVERS

Rising demand for SiC wafers in EV power modules

Energy-efficient EVs are fueling wafer thinning demand: SiC is now used in over 58% of global power device inventories, and SiC modules featured in more than 9 million EVs last year. With wafer producers struggling to meet ramps (more than 15% growth in demand), thinning equipment capacity is being stretched by 25–30%.

OPPORTUNITY

Expansion into high-frequency and 5G devices

SiC’s utility in RF and telecom is rising: high-frequency electronics now consume about 23% of global SiC wafers, up from 15% two years ago. The 5G rollout is projected to increase wafer thinning equipment orders by 20% annually, as manufacturers target higher throughput and ultra-precise thinning for RF components.

RESTRAINTS

"Limited availability of high-quality SiC substrates"

The availability of defect-free and ultra-flat SiC substrates remains a key bottleneck in the wafer thinning equipment market. Nearly 35% of manufacturers report difficulties in sourcing consistent substrate materials, leading to delays in process optimization and equipment utilization. Additionally, over 42% of wafer processing plants cite substrate warpage and micro-cracking as persistent issues, which directly impact thinning precision. Thin wafer breakage rates are still as high as 18% in some pilot lines, reducing production yield. These substrate-related quality constraints limit broader equipment adoption and delay transition to next-gen 8-inch SiC wafer processing capabilities.

CHALLENGE

"Rising costs and process integration complexity"

The growing sophistication of thinning technologies is pushing up both equipment and operational costs. Advanced systems with integrated CMP and AI-control modules now account for over 52% of installations, but these require high capital investments and skilled labor, which only 29% of facilities can currently support. Furthermore, over 40% of semiconductor fabs report challenges in aligning thinning systems with downstream processes such as dicing and inspection. Process incompatibility issues lead to 12–15% downtime across SiC wafer lines. These integration complexities and cost pressures present significant barriers, especially for small- to mid-sized fabs entering the SiC sector.

Segmentation Analysis

The SiC Wafer Thinning Equipment Market is categorized based on type and application, each playing a crucial role in determining operational performance, automation level, and scalability across industries. In terms of equipment type, full-automatic systems dominate the market due to their speed, precision, and integration capability in high-volume fabs. Semi-automatic systems, while still widely used in niche and R&D settings, are gradually declining in adoption due to increased demand for throughput and repeatability. From the application side, the shift from

By Type

• Full-Automatic: Full-automatic SiC wafer thinning equipment accounts for over 65% of installations globally. These systems offer high-speed processing, automated control modules, and compatibility with AI and Industry 4.0 integration. Their adoption is especially high in Asia-Pacific fabs, where demand for scalable manufacturing lines is rising. Over 58% of advanced fabs exclusively use full-automatic solutions to meet high output and precision standards.
• Semi-Automatic: Semi-automatic equipment still holds a 35% market share, largely due to its affordability and flexibility in pilot-line or low-volume operations. These systems are commonly deployed in academic research centers, specialty semiconductor facilities, and small-scale fabs. However, as throughput demands increase, reliance on semi-automatic systems is projected to decrease, with 22% of current users planning upgrades within the next production cycle.

By Application

• Less than 6 Inch: Equipment for wafers below 6 inches serves legacy applications and custom semiconductor segments. It currently represents about 38% of total market share. Many legacy fabs still process 4-inch wafers, especially for discrete power devices and niche electronics. However, thinning equipment in this category is gradually being phased out in favor of larger wafer capability.
• 6 Inch and Above: This segment commands a strong 62% share, driven by high demand from electric vehicles, telecom, and energy industries. 6-inch and 8-inch wafer lines provide better economies of scale and yield, making them more favorable for high-volume manufacturing. Major fabs in Asia-Pacific and North America are shifting entirely to 6-inch and above lines, with over 70% of new equipment orders supporting these sizes.

SiC Wafer Thinning Equipment Market Regional Outlook

The global SiC wafer thinning equipment market demonstrates varied regional performance, influenced by technological maturity, fab investment, and demand for power electronics. Asia-Pacific leads with the largest market share due to rapid industrialization, strong EV manufacturing base, and local equipment providers. North America follows with a robust push from electric vehicles, defense electronics, and advanced research. Europe remains steady with government-backed clean energy and auto initiatives. The Middle East & Africa is emerging slowly, focused on foundational investment and pilot fabs. Market share breakdown by region is as follows: Asia-Pacific (45%), North America (30%), Europe (20%), and Middle East & Africa (5%).

North America

North America holds a significant 30% of the global market share. Demand is fueled by strong government funding for semiconductor innovation and a surge in domestic EV manufacturing. Over 54% of new fabs in the region are integrating SiC wafer processes, especially in the U.S. states with tax incentives. The region also benefits from the presence of several leading fabless design houses and tool manufacturers. Nearly 68% of advanced R&D centers now include SiC wafer thinning lines as part of pilot projects. Adoption of full-automatic systems is growing, accounting for 61% of all new installations in the region.

Europe

Europe captures 20% of the global market, driven by the region's strong automotive and energy sectors. Germany, France, and the Netherlands are central to SiC development, with more than 48% of new EV power module projects incorporating SiC technology. Regional investments focus on green mobility and energy transition. EU-funded semiconductor initiatives are pushing thinning equipment adoption in public-private fab ventures. Over 36% of thinning systems in Europe are now equipped with advanced polishing modules, meeting demand for ultra-low defect SiC wafer production. Equipment localization efforts are also underway, with 29% of tools now being sourced within the EU.

Asia-Pacific

Asia-Pacific leads globally with a dominant 45% share in the SiC wafer thinning equipment market. This region benefits from high-volume fab clusters in China, Japan, South Korea, and Taiwan. SiC wafer production in this area has grown by more than 40% in the past production cycle, and over 66% of fabs have upgraded to 6-inch or higher wafer lines. Full-automatic systems make up 73% of equipment orders here, driven by demand for precision and throughput. Governments are actively investing in local toolmakers, and over 58% of new equipment is developed or assembled regionally. Asia-Pacific remains the core hub for next-generation SiC processing infrastructure.

Middle East & Africa

Middle East & Africa represents 5% of the global market share. The region is at an early stage of adoption but has shown increased interest in semiconductor infrastructure. Countries like the UAE and Saudi Arabia are initiating partnerships to set up pilot fabs focused on power electronics and clean tech. Around 12% of research centers in the region are now equipped with semi-automatic SiC thinning equipment for prototyping. Demand is growing in sectors like solar, smart grids, and electric transport, driving pilot-scale investment. Though small, this region holds potential for future growth with public-private R&D collaboration expanding gradually.

List of Key SiC Wafer Thinning Equipment Market Companies Profiled

Investment Analysis and Opportunities

Global investments in SiC wafer thinning equipment are surging as manufacturers shift from traditional silicon to Silicon Carbide for better thermal and electrical performance. Over 68% of new capital expenditure from semiconductor fabs now targets SiC-compatible equipment. Asia-Pacific leads this trend, accounting for 52% of all new equipment investments in the past cycle. North America follows with 27%, focused on domestic fab expansion. Europe allocates around 16% to upgrade existing lines. More than 44% of fab managers report increasing their budgets for full-automatic thinning systems over the next two cycles. R&D investments have also risen by 35%, especially in CMP technology and defect-free wafer handling. Meanwhile, public-private initiatives are funding around 22% of the total investment volume, particularly for pilot fabs and infrastructure scaling. These figures indicate strong long-term opportunities in automation, eco-friendly processing, and AI-enabled systems, especially for players that can deliver precision and cost efficiency at scale.

New Products Development

SiC wafer thinning equipment manufacturers are accelerating innovation to meet the evolving demands of next-generation semiconductor applications. Around 57% of companies have introduced upgraded full-automatic grinders and polishers in the last development cycle. Disco and Okamoto have launched ultra-thin precision equipment capable of processing wafers down to 50µm with under 3% variation. Over 49% of new product lines now integrate smart sensors and AI-enabled thickness monitoring systems to reduce manual calibration. About 33% of all new systems launched include eco-friendly CMP modules that consume 22% less slurry and reduce waste by 18%. Semi-automatic product variants are being phased out gradually, with only 19% of companies still offering them in their catalogs. The trend is clearly toward high-throughput, digitally controlled, and sustainable machines. Nearly 41% of companies are partnering with AI firms or research centers to co-develop next-gen thinning solutions that can support 8-inch and future 12-inch SiC wafer lines.

Recent Developments

• Disco launched next-gen ultra-thin wafer grinder (2024): In 2024, Disco introduced a next-gen thinning system capable of grinding SiC wafers to below 40μm thickness with less than 2.5% variation. The system integrates real-time AI feedback and fully automated wafer handling. Over 61% of Disco’s newly installed systems in Asia-Pacific fabs are based on this upgraded platform, reducing cycle time by 28%.
• TOKYO SEIMITSU unveiled AI-integrated CMP solution (2023): In late 2023, Tokyo Seimitsu revealed a polishing system embedded with AI algorithms for dynamic planarization control. It showed a 34% reduction in wafer surface non-uniformity during testing. About 46% of early adopters confirmed consistent improvements in post-thinning yield and defect density drop by 22%.
• Okamoto introduced hybrid semi-auto platform (2024): Okamoto rolled out a hybrid model in 2024 combining manual precision adjustments with automatic control for R&D lines. It caters to universities and specialty fabs, with over 31% adoption reported in small-scale production labs across Europe and Japan. The hybrid model cut operator intervention time by 37%.
• Revasum enhanced its 7AF-HMG platform (2023): In 2023, Revasum upgraded its flagship 7AF-HMG grinding tool with advanced vacuum chuck design, improving wafer hold strength by 29%. More than 52% of customers using the tool in pilot-scale EV fabs reported reduced wafer edge damage and better process repeatability, especially for 6-inch and above wafers.
• CETC launched domestic equipment initiative (2024): CETC initiated a localization strategy in 2024, focusing on developing thinning tools within China to reduce foreign dependency. Already, 44% of newly deployed CETC systems are built using over 85% domestic components. The move increased government-backed adoption by 26% across public R&D fabs.

Report Coverage

The SiC Wafer Thinning Equipment Market report offers comprehensive insight into current industry dynamics, technological advancements, and strategic movements across regions and segments. It covers product types such as full-automatic and semi-automatic systems, which together make up 100% of the installed base. Application-wise, the report addresses the shift from less than 6-inch wafers to 6-inch and above, which now hold a dominant 62% share. Regional analysis highlights Asia-Pacific's 45% lead, followed by North America at 30%, Europe at 20%, and the Middle East & Africa at 5%. The report tracks more than 25 manufacturers, six of which are profiled in depth. Over 38% of the report content focuses on automation and AI integration, while 29% of the data addresses sustainability and eco-efficient features. It also provides breakdowns of investment patterns, with 68% of fabs increasing spending on thinning equipment. New product innovations, making up 41% of company strategies, are also deeply analyzed across the 2023–2024 timeframe.